It is especially suitable for the high-end market of ultra-fine processing, such as food, pharmaceutical packaging material marking, micro-hole drilling, high-speed division of glass materials, and complex pattern cutting of silicon wafers.
Email: joy@dumanlaser.com
Item NO. :
DMM-UV7WPayment :
L/C D/A D/P T/T Western UnionProduct Origin :
ChinaShipping Port :
XiamenLead Time :
15 days2W 3W 5W 7W UV Laser Engraving Machine for LEO Wafer & Glass Marking
UV laser marking machine is developed by using a 355nm UV laser, it adopts third-order cavity frequency multiplication technology. Compared to infrared laser, the focusing spot of UV laser is much smaller, which helps to reduce the mechanical deformation of the materials to a large extent. It features of smaller heat affected area and more beautiful marking effect.
It is especially suitable for the high-end market of ultra-fine processing, such as food, pharmaceutical packaging material marking, micro-hole drilling, high-speed division of glass materials, and complex pattern cutting of silicon wafers.
Applicable Industry
Medicine, food, low voltage electric appliance, LEO wafer，touch screen ITO film, plastic and so on.
Product features
1. Cold laser, particularly suitable for micromachining
2. Air cooling
3. New semiconductor laser source , high electricity-laser exchange ratio, long using lifetime
4. Third-order intracavity frequency doubling technology , tiny spot, basically no heat affected processing
5. Low power consuming, maintenance free, stable performance
Technical parameter
|
Laser power |
2W/3W/5W/7W |
|
Wavelength |
355nm |
|
Beam quality |
㎡＜1.3 |
|
Marking scope |
65×65/110×110/160×160mm(optional) |
|
Marking speed |
≤7000mm/s |
|
Min. line width |
0.01mm |
|
Min. Character |
0. 1mm |
|
Pulse energy |
150uj(20KHz) |
|
Repeat precision |
10-200KHz |
|
Power supply |
220V±10% 50Hz/12A |
|
Power consumption |
400W |
|
Working temperature |
5℃--35℃ |
It is especially suitable for the high-end market of ultra-fine processing, such as food, pharmaceutical packaging material marking, micro-hole drilling, high-speed division of glass materials, and complex pattern cutting of silicon wafers. Email: joy@dumanlaser.com
UV laser marking machine suitable for high-end market for ultra-fine processing, such as mobile phones, chargers, data cables, pharmaceutical packages,cosmetics packages, and polymer materials surface marking. Also it can be used for marking of flexible PCB boards, dicing micro-holes and blind holes for silicon wafers, LCDQA code marking, glassware punching, metal surface marking, plastic buttons, electronic components, gifts, communication equipment, building materials, etc. Email: joy@dumanlaser.com
It is especially suitable for fine marking of sapphire, quartz, ceramics, glass and other superhard materials. Email: joy@dumanlaser.com
It is especially suitable for fine marking of sapphire, quartz, ceramics, glass and other superhard materials. Email: joy@dumanlaser.com
It is especially suitable for fine marking of sapphire, quartz, ceramics, glass and other superhard materials. Please send your inquiry to Email: joy@dumanlaser.com
3D Dynamic marking adopts pre-focusing optical mode and larger X and Y axis deflection lenses, so it can allow larger laser spot, better focusing accuracy and better energy effect. The marking range can be wider. Please send your inquiry to Email: joy@dumanlaser.com
Laser Cladding Machines widely used in mining, coal, petroleum, metallurgical industry, cement machinery industry, electrical machinery industry, construction machinery, auto repair industry, printing industry, paper industry and other industries. Please send you inquiry to Email: joy@dumanlaser.com
Laser Welding Machine is widely used in mobile phone battery shell, electronic components, mobile communication, precision equipment, hardware products, automotive accessories, glasses, clocks, jewelry, medical equipment, thermal cups, wine pots, kitchens and other industries. Please send your inquiry to Email: joy@dumanlaser.com
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