Picosecond Laser Cutting Machine for Mobile Phone Screen Protector LED LCD Glass
Picosecond cutting machine is a precision cutting machine. It uses the peak power to cut quickly in a short time, so that the material can not have time to conduct heat. It can achieve the cutting of transparent brittle materials without damaging the structure of the material.
Picosecond processing uses small single pulse energy, high frequency processing, fine carving, processing surface is more fine and smooth. There are three power options: 30W, 50W and 70W. The working area of 600mm*500mm is suitable for most cutting scenes. lt can be used for 0.1mm-6mm reinforced and non reinforced glass cutting, such as mobile phone glass cover, car glass cover and camera glass cover. 0.1mm-2mm sapphire glass cutting, such as: mobile phone sapphire cover,camera sapphire glass cover, sapphire lamp post(LED lamp post).LCD glass cutting and other optical lens cutting.processing.
Specification
Model
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DM6050
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Laser source power
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30W 50W 70W
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Machine structure
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X,Y,Z Marble Table
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Max. stroke
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600mm*500mm*100mm
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Re-positioning accuracy of motion platform
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±1um
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Positioning accuracy of motion platform
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±2um
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Supported files
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DXF,PLT,DWG
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CCD Vision positioning accuracy
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±3um
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Laser source wavelength
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1064nm
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Beam quality
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M²<1.3
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Minimum focus spot
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3um
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Cooling type
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Constant temperature water cooling
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Processing speed
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0-500mm/s adjustable
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Samples